Royole Raises $800M USD in Series D Funding

Royole Corporation announced Wednesday that it has raised a total of ~$800M USD in its Series D round of funding and holds Cooperation Agreements from top investors.

They include Bank of China, Industrial and Commercial Bank of China, China CITIC Bank, Agricultural Bank of China, Ping An Bank, Warmsun Holding Group, Hanfor Capital, SPD Bank, Zhonghai Shengrong Capital, and Tanshi Capital.

Royole is a leading innovator and manufacturer of next-generation human-machine interface technologies and products such as advanced flexible displays, flexible sensors, and smart devices.

Royole’s Series D funding includes: $240M USD of equity financing from Warmsun Holding Group, Hanfor Capital, SPD Bank, Zhonghai Shengrong Capital, and TanShi Capital; and $560M USD of debt financing from Bank of China, Industrial and Commercial Bank of China, China CITIC Bank, Agricultural Bank of China, and Ping An Bank.

Royole was co-founded in Silicon Valley, Shenzhen and Hong Kong in 2012 by three Stanford and Tsinghua engineering graduates.

Since its inception, the company has received five rounds of investments from global venture capitalists and private equity firms, including IDG Capital, Shenzhen Capital Group, CITIC Capital, Costone Capital, Knights Investment Group, and Alpha Wealth.

In October 2016, Royole completed its pre-D round of funding with a company valuation of $3B USD. Its core technologies and products include the world’s thinnest full-color AMOLED flexible display with a thickness of only 0.01mm and a bending radius of 1mm; novel flexible sensor technology on transparent, super-thin, flexible film; and Moon, a 3D mobile theater for movies, gaming, and more. Throughout the past five years, Royole has filed more than 1,200 core technology intellectual property rights.