Five-in-One Wireless Connectivity with TI’s WiLink

RMN Digital | February 13, 2012 | Applications, Consumer, Corporate, Enterprise, Enterprise Events, Europe, Events, Mobiles, Regions, Strategy | No Comments

Texas Instruments (TI) (NASDAQ: TXN) has introduced the WiLink 8.0 product family: a collection of 45-nanometer single-chip solutions that integrate up to five different radios, and set the stage for next-generation mobile Wi-Fi, GNSS, NFC, Bluetooth and FM transmit/receive applications.

The WiLink 8.0 architecture supports various combinations of these technologies, allowing for customized solutions to address the unique needs and price points of all mobile markets, says the company.

Each chip variant comes in a compact WSP package that can be mounted directly on a PCB, and includes all required RF front ends, a complete power management system, and comprehensive coexistence mechanisms.

At the system level, according to the company, the five-radio WiLink 8.0 chip offers a 60 percent cost reduction, 45 percent decrease in size and 30 percent lower power consumption compared to traditional multi-chip offerings.

WiLink 8.0 solutions are sampling today, Feb. 13, to top-tier mobile OEMs, and will be demonstrated at TI’s booth at Mobile World Congress in Barcelona, Feb. 27 to March 1.

According to the company, products with WiLink 8.0 solutions inside are expected to ship in the second half of 2012.